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8479.79.00.00/Multi-Wire Wafer Slicer/Japan

Multi-Wire Wafer Slicer from Japan

Advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule, maximizing yield. Fixed abrasive technology reduces slurry use. Classified under HTS 8479.79.00.00 for high-throughput wafer production.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify wire diameter (50-100μm) and slice thickness capability; tensioning system details required

• Avoid generic saw classification

Multi-Wire Wafer Slicer from Japan — Import Duty Rate | HTS 8479.79.00.00