Multi-Wire Wafer Slicer from Germany
Advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule, maximizing yield. Fixed abrasive technology reduces slurry use. Classified under HTS 8479.79.00.00 for high-throughput wafer production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter (50-100μm) and slice thickness capability; tensioning system details required
• Avoid generic saw classification