Multi-Wire Wafer Slicer from China
Advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule, maximizing yield. Fixed abrasive technology reduces slurry use. Classified under HTS 8479.79.00.00 for high-throughput wafer production.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify wire diameter (50-100μm) and slice thickness capability; tensioning system details required
• Avoid generic saw classification