Multi-Wire Wafer Slicer from Canada
Advanced diamond wire saw using multiple parallel wires to simultaneously slice hundreds of thin wafers from a single boule, maximizing yield. Fixed abrasive technology reduces slurry use. Classified under HTS 8479.79.00.00 for high-throughput wafer production.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify wire diameter (50-100μm) and slice thickness capability; tensioning system details required
• Avoid generic saw classification