Epi-Ready Wafer Polisher from Japan
Final polishing station producing 'epi-ready' semiconductor wafers with atomic-level surface flatness for epitaxial layer growth. Uses colloidal silica for damage-free finish. Classified HTS 8479.79.00.00 for final preparation machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide site flatness (SFQR <0.1μm) specs; cleanroom class certification
• Avoid metrology instrument error