Epi-Ready Wafer Polisher from Japan
Final polishing station producing 'epi-ready' semiconductor wafers with atomic-level surface flatness for epitaxial layer growth. Uses colloidal silica for damage-free finish. Classified HTS 8479.79.00.00 for final preparation machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide site flatness (SFQR <0.1μm) specs; cleanroom class certification
• Avoid metrology instrument error