Epi-Ready Wafer Polisher from China
Final polishing station producing 'epi-ready' semiconductor wafers with atomic-level surface flatness for epitaxial layer growth. Uses colloidal silica for damage-free finish. Classified HTS 8479.79.00.00 for final preparation machinery.
Duty Rate — China → United States
20%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide site flatness (SFQR <0.1μm) specs; cleanroom class certification
• Avoid metrology instrument error