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8479.79.00.00/Double-Sided Wafer Grinder/Mexico

Double-Sided Wafer Grinder from Mexico

Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. Achieves thickness uniformity across 300mm wafers. HTS 8479.79.00.00 for simultaneous surface preparation.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Provide thickness variation specs (<1μm); carrier plate details needed

• Pitfall: single-side grinder confusion

Double-Sided Wafer Grinder from Mexico — Import Duty Rate | HTS 8479.79.00.00