Double-Sided Wafer Grinder from Mexico
Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. Achieves thickness uniformity across 300mm wafers. HTS 8479.79.00.00 for simultaneous surface preparation.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide thickness variation specs (<1μm); carrier plate details needed
• Pitfall: single-side grinder confusion