8479.79.00.00/Double-Sided Wafer Grinder/Japan

Double-Sided Wafer Grinder from Japan

Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. Achieves thickness uniformity across 300mm wafers. HTS 8479.79.00.00 for simultaneous surface preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide thickness variation specs (<1μm); carrier plate details needed

• Pitfall: single-side grinder confusion