Double-Sided Wafer Grinder from Japan
Equipment that simultaneously grinds both sides of semiconductor wafers using planetary motion and diamond pads for rapid stock removal. Achieves thickness uniformity across 300mm wafers. HTS 8479.79.00.00 for simultaneous surface preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide thickness variation specs (<1μm); carrier plate details needed
• Pitfall: single-side grinder confusion