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Crystal Defect Etcher from Japan

Automated wet bench station using chemical etching to reveal and measure bulk defects in semiconductor crystals before wafering, ensuring material quality. Includes thickness mapping. Under HTS 8479.79.00.00 as quality preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Chemical handling safety data mandatory; etch rate uniformity specs

Pitfall: chemical apparatus under 8419

Crystal Defect Etcher from Japan — Import Duty Rate | HTS 8479.79.00.00