Crystal Defect Etcher from Japan
Automated wet bench station using chemical etching to reveal and measure bulk defects in semiconductor crystals before wafering, ensuring material quality. Includes thickness mapping. Under HTS 8479.79.00.00 as quality preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Chemical handling safety data mandatory; etch rate uniformity specs
• Pitfall: chemical apparatus under 8419