Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds flats indicating conductivity type and resistivity. Critical step in wafer preparation after growth. Classified in HTS 8479.79.00.00 for mechanical preparation machines in semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document diameter precision specs to distinguish from general grinders; obtain cleanroom compatibility certifications
• Pitfall: confusing with optical lens grinders