Chemical Mechanical Wafer Polisher from Mexico
CMP tool integrating chemical slurry and mechanical polishing to planarize semiconductor wafers during device fabrication, removing oxide/metal layers uniformly. Includes endpoint detection systems. Under HTS 8479.79.00.00 as fabrication preparation equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail platen rotation and downforce control; slurry certification required
• Common error: classifying under general polishers