8479.79.00.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP tool integrating chemical slurry and mechanical polishing to planarize semiconductor wafers during device fabrication, removing oxide/metal layers uniformly. Includes endpoint detection systems. Under HTS 8479.79.00.00 as fabrication preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail platen rotation and downforce control; slurry certification required

• Common error: classifying under general polishers