Chemical Mechanical Wafer Polisher from Germany
CMP tool integrating chemical slurry and mechanical polishing to planarize semiconductor wafers during device fabrication, removing oxide/metal layers uniformly. Includes endpoint detection systems. Under HTS 8479.79.00.00 as fabrication preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Detail platen rotation and downforce control; slurry certification required
• Common error: classifying under general polishers