8479.79.00.00/Chemical Mechanical Wafer Polisher/Canada

Chemical Mechanical Wafer Polisher from Canada

CMP tool integrating chemical slurry and mechanical polishing to planarize semiconductor wafers during device fabrication, removing oxide/metal layers uniformly. Includes endpoint detection systems. Under HTS 8479.79.00.00 as fabrication preparation equipment.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Detail platen rotation and downforce control; slurry certification required

• Common error: classifying under general polishers

Chemical Mechanical Wafer Polisher from Canada — Import Duty Rate | HTS 8479.79.00.00