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8479.79.00.00/Boule Diameter Profiler/Japan

Boule Diameter Profiler from Japan

Precision measuring and grinding station that profiles crystal boules to uniform cylindrical diameter with laser gauging. Ensures consistent wafer dimensions from variable growth shapes. Under HTS 8479.79.00.00 as semiconductor boule preparation machinery.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include laser measurement accuracy specs (±0.01mm); calibrate before import inspection

• Common issue: classifying as metrology under 9031

Boule Diameter Profiler from Japan — Import Duty Rate | HTS 8479.79.00.00