Boule Diameter Profiler from Japan
Precision measuring and grinding station that profiles crystal boules to uniform cylindrical diameter with laser gauging. Ensures consistent wafer dimensions from variable growth shapes. Under HTS 8479.79.00.00 as semiconductor boule preparation machinery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include laser measurement accuracy specs (±0.01mm); calibrate before import inspection
• Common issue: classifying as metrology under 9031