Boule Diameter Profiler from Japan
Precision measuring and grinding station that profiles crystal boules to uniform cylindrical diameter with laser gauging. Ensures consistent wafer dimensions from variable growth shapes. Under HTS 8479.79.00.00 as semiconductor boule preparation machinery.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include laser measurement accuracy specs (±0.01mm); calibrate before import inspection
• Common issue: classifying as metrology under 9031