Semiconductor Rubber Molder Clamp Cylinder from Japan
Hydraulic clamp cylinder for compression molding machines (8477.10.90) used to produce precision rubber gaskets for semiconductor wafer handling equipment. This ram/cylinder is explicitly covered under 8477.90.25.40 for these specialized machines.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify hydraulic pressure ratings match OEM specs for 8477.10 machines
• Use ISPM-15 compliant wood-free packaging for overseas shipping
• Avoid misdeclaration as general hydraulics to prevent 8412 classification