Extruder Clamp Cylinder Casting
Ductile iron casting for clamp cylinder in rubber extruders (8477.10.40) used for semiconductor profile extrusion. Covered by 8477.90.25.40's clamp cylinder specification.
Import Duty Rates by Country of Origin
Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If rough castings pre-machining
Iron castings classified by composition in Chapter 73.
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The Tariff Assistant works through the GRI rules on your specific product to reach the right HTS code — and can price the duty on it in the same conversation.
Import Tips & Compliance
• Ensure casting porosity certifications for high-pressure applications
• Batch traceability documentation required for quality compliance
Related Products under HTS 8477.90.25.40
Semiconductor Rubber Molder Clamp Cylinder
Hydraulic clamp cylinder for compression molding machines (8477.10.90) used to produce precision rubber gaskets for semiconductor wafer handling equipment. This ram/cylinder is explicitly covered under 8477.90.25.40 for these specialized machines.
Molding Machine Base Platen Weldment
Heavy welded platen base for transfer molding machines (8477.10.90), essential for semiconductor rubber molding operations. Qualifies under 8477.90.25.40 as base/platen weldment.
Rubber Processor Ram Casting
Precision-machined ram casting for high-pressure rubber processing units (8477.10.30/90). Used in semiconductor gasket production, fitting 8477.90.25.40 ram criteria.
Kneader Machine Bed Fabrication
Fabricated bed frame for rubber kneading/mixing machines (8477.10.30), supporting rotor assemblies in semiconductor compound preparation. Named in 8477.90.25.40.
Semiconductor Seal Extruder Platen
Aluminum alloy platen for rubber extruders producing semiconductor seals (8477.10.40). Specifically classified under 8477.90.25.40 platen provision.
Injection Molding Machine Platen Casting
A heavy-duty cast iron platen used in rubber injection molding machines under HTS 8477.10.30 to securely hold molds during high-pressure injection cycles. It falls under 8477.90.25.40 as a specified base, bed, platen casting dedicated to these semiconductor-related rubber processing machines.