Crystal Boule Grinder Spindle Assembly from Japan
Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. Parts of wafer preparation equipment classified in HTS 8475.90.90.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document diameter precision (e.g
• ±0.01mm) and flat grinding for resistivity marking
• Use HS explanatory notes references for semiconductor statistical provisions