8475.90.90.00/Crystal Boule Grinder Spindle Assembly/Japan

Crystal Boule Grinder Spindle Assembly from Japan

Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. Parts of wafer preparation equipment classified in HTS 8475.90.90.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document diameter precision (e.g

• ±0.01mm) and flat grinding for resistivity marking

• Use HS explanatory notes references for semiconductor statistical provisions