8475.90.90.00/Crystal Boule Grinder Spindle Assembly/Japan

Crystal Boule Grinder Spindle Assembly from Japan

Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. Parts of wafer preparation equipment classified in HTS 8475.90.90.00.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document diameter precision (e.g

• ±0.01mm) and flat grinding for resistivity marking

• Use HS explanatory notes references for semiconductor statistical provisions

Crystal Boule Grinder Spindle Assembly from Japan — Import Duty Rate | HTS 8475.90.90.00