Crystal Boule Grinder Spindle Assembly from Germany
Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. Parts of wafer preparation equipment classified in HTS 8475.90.90.00.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document diameter precision (e.g
• ±0.01mm) and flat grinding for resistivity marking
• Use HS explanatory notes references for semiconductor statistical provisions