8475.29.00.00/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

High-precision inner-diameter saw with diamond blade for slicing thin wafers from silicon boules, featuring glass coolant systems and hot-worked enclosures. Fits HTS 8475.29.00.00 as wafer preparation equipment involving glassware manufacturing. Produces uniform wafers for IC fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide slicing thickness tolerances (<100 microns) and coolant system diagrams; ensure diamond blade certification

• Common issue: bulk classification without wafer-specific proof