Wafer Slicing Diamond Saw from China
High-precision inner-diameter saw with diamond blade for slicing thin wafers from silicon boules, featuring glass coolant systems and hot-worked enclosures. Fits HTS 8475.29.00.00 as wafer preparation equipment involving glassware manufacturing. Produces uniform wafers for IC fabrication.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide slicing thickness tolerances (<100 microns) and coolant system diagrams; ensure diamond blade certification
• Common issue: bulk classification without wafer-specific proof