Wafer Slicing Diamond Saw from Canada
High-precision inner-diameter saw with diamond blade for slicing thin wafers from silicon boules, featuring glass coolant systems and hot-worked enclosures. Fits HTS 8475.29.00.00 as wafer preparation equipment involving glassware manufacturing. Produces uniform wafers for IC fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide slicing thickness tolerances (<100 microns) and coolant system diagrams; ensure diamond blade certification
• Common issue: bulk classification without wafer-specific proof