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8475.29.00.00/Wafer Polishing Platform/Japan

Wafer Polishing Platform from Japan

Rotary platform with glass carriers for chemical-mechanical polishing of wafers to mirror finish, involving hot-processed glass components. Falls under HTS 8475.29.00.00 as semiconductor wafer prep equipment. Prepares for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Provide CMP slurry flow diagrams; ensure platen flatness certs

• Distinguish from testing apparatus

Wafer Polishing Platform from Japan — Import Duty Rate | HTS 8475.29.00.00