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Wafer Polishing Platform from Germany

Rotary platform with glass carriers for chemical-mechanical polishing of wafers to mirror finish, involving hot-processed glass components. Falls under HTS 8475.29.00.00 as semiconductor wafer prep equipment. Prepares for device fabrication.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Import Tips

Provide CMP slurry flow diagrams; ensure platen flatness certs

Distinguish from testing apparatus