Wafer Polishing Platform from Germany
Rotary platform with glass carriers for chemical-mechanical polishing of wafers to mirror finish, involving hot-processed glass components. Falls under HTS 8475.29.00.00 as semiconductor wafer prep equipment. Prepares for device fabrication.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide CMP slurry flow diagrams; ensure platen flatness certs
• Distinguish from testing apparatus