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8475.29.00.00/Wafer Polishing Platform/China

Wafer Polishing Platform from China

Rotary platform with glass carriers for chemical-mechanical polishing of wafers to mirror finish, involving hot-processed glass components. Falls under HTS 8475.29.00.00 as semiconductor wafer prep equipment. Prepares for device fabrication.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Provide CMP slurry flow diagrams; ensure platen flatness certs

• Distinguish from testing apparatus

Wafer Polishing Platform from China — Import Duty Rate | HTS 8475.29.00.00