8475.29.00.00/Silicon Wafer Lapper/Japan

Silicon Wafer Lapper from Japan

Machine that laps silicon wafers to precise flatness using abrasive slurries in glass-lined polishing stations, part of hot glassware processing for semiconductors. Classified in HTS 8475.29.00.00 under wafer preparation equipment. Achieves surface flatness critical for lithography.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit flatness spec sheets (e.g

• <1 micron); verify slurry compatibility

• Pitfall: confusing with final chemical-mechanical polishers