Silicon Wafer Lapper from Japan
Machine that laps silicon wafers to precise flatness using abrasive slurries in glass-lined polishing stations, part of hot glassware processing for semiconductors. Classified in HTS 8475.29.00.00 under wafer preparation equipment. Achieves surface flatness critical for lithography.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit flatness spec sheets (e.g
• <1 micron); verify slurry compatibility
• Pitfall: confusing with final chemical-mechanical polishers