Silicon Wafer Lapper from Germany
Machine that laps silicon wafers to precise flatness using abrasive slurries in glass-lined polishing stations, part of hot glassware processing for semiconductors. Classified in HTS 8475.29.00.00 under wafer preparation equipment. Achieves surface flatness critical for lithography.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit flatness spec sheets (e.g
• <1 micron); verify slurry compatibility
• Pitfall: confusing with final chemical-mechanical polishers