Silicon Wafer Lapper from China
Machine that laps silicon wafers to precise flatness using abrasive slurries in glass-lined polishing stations, part of hot glassware processing for semiconductors. Classified in HTS 8475.29.00.00 under wafer preparation equipment. Achieves surface flatness critical for lithography.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Submit flatness spec sheets (e.g
• <1 micron); verify slurry compatibility
• Pitfall: confusing with final chemical-mechanical polishers