Glass Envelope Sealing Machine from Japan
Automated machine for hermetically sealing glass envelopes around semiconductor components during hot working, used in device packaging. HTS 8475.29.00.00 covers other glassware manufacturing for electronics. Ensures vacuum integrity.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document seal temperature profiles; comply with vacuum specs
• Pitfall: parts classification without full machine status