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8475.29.00.00/Glass Envelope Sealing Machine/Japan

Glass Envelope Sealing Machine from Japan

Automated machine for hermetically sealing glass envelopes around semiconductor components during hot working, used in device packaging. HTS 8475.29.00.00 covers other glassware manufacturing for electronics. Ensures vacuum integrity.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document seal temperature profiles; comply with vacuum specs

• Pitfall: parts classification without full machine status