Crystal Boule Grinder from Japan
Precision grinder for shaping silicon boules to exact diameters and flats indicating conductivity, often using glass tooling or enclosures for thermal control during hot processing. Under HTS 8475.29.00.00 as other glassware manufacturing machine per statistical notes on wafer preparation. Ensures wafers meet semiconductor fabrication tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include boule diameter specs and flat grinding documentation; certify for cleanroom compatibility
• Pitfall: classifying as general metal grinder without semiconductor context