Crystal Boule Grinder from Japan
Precision grinder for shaping silicon boules to exact diameters and flats indicating conductivity, often using glass tooling or enclosures for thermal control during hot processing. Under HTS 8475.29.00.00 as other glassware manufacturing machine per statistical notes on wafer preparation. Ensures wafers meet semiconductor fabrication tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule diameter specs and flat grinding documentation; certify for cleanroom compatibility
• Pitfall: classifying as general metal grinder without semiconductor context