Crystal Boule Grinder

Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats, preparing them for slicing into wafers used in glass-enclosed electronic lamps and tubes. HTS 8475.10.00.00 applies as part of the assembly process for devices in glass envelopes per chapter notes.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8460.40.40Higher: 39.4% vs 35%

If for grinding semiconductor wafers post-slicing, not boules

Wafer-specific grinding falls under Chapter 84 honing/grinding machines, outside boule prep for lamps.

8486.40.00Lower: 25% vs 35%

If industrial semiconductor diameter grinding without lamp context

Dedicated semiconductor equipment excludes glass envelope assembly machines per statistical notes.

9018.90.30.00Same rate: 35%

If used for image/test equipment component fabrication

Certain testing-related grinders classify in Chapter 90 apparatus.

Not sure which classification is right?

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Import Tips & Compliance

Submit engineering drawings highlighting flat-grinding for conductivity indication, linking to lamp assembly workflow

Certify compliance with semiconductor material processing standards to prevent Chapter 90 optical grinder misclassification