Wafer Crystal Grinder Abrasive Wheels from Japan
Diamond-impregnated grinding wheels for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing, as defined in statistical notes for semiconductor processing. Used on silicon or gallium arsenide crystals. HTS 8474.90.0020 includes these as parts of grinding machines for mineral substances like semiconductor crystals.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Reference statistical note (a)(ii)(A) crystal grinders in documentation
• Grit size and bond type specs prove semiconductor boule application
• Cleanroom packaging required to prevent contamination claims