Wafer Crystal Grinder Abrasive Wheels from China
Diamond-impregnated grinding wheels for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing, as defined in statistical notes for semiconductor processing. Used on silicon or gallium arsenide crystals. HTS 8474.90.0020 includes these as parts of grinding machines for mineral substances like semiconductor crystals.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Reference statistical note (a)(ii)(A) crystal grinders in documentation
• Grit size and bond type specs prove semiconductor boule application
• Cleanroom packaging required to prevent contamination claims