Wafer Slicing Diamond Saw Blade from Japan
High-precision diamond-impregnated saw blade designed exclusively for slicing semiconductor boules into thin wafers in wafer preparation equipment. Classified under HTS 8473.50.9000 as a part suitable for machines of 8471 used in semiconductor processing. Ensures minimal material loss and precise wafer thickness.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Require material safety data sheets for diamond abrasives; confirm blade specifications match target boule materials; watch for anti-dumping duties on certain Asian origins