Wafer Slicing Diamond Saw Blade from Germany
High-precision diamond-impregnated saw blade designed exclusively for slicing semiconductor boules into thin wafers in wafer preparation equipment. Classified under HTS 8473.50.9000 as a part suitable for machines of 8471 used in semiconductor processing. Ensures minimal material loss and precise wafer thickness.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Require material safety data sheets for diamond abrasives; confirm blade specifications match target boule materials; watch for anti-dumping duties on certain Asian origins