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8473.50.90.00/Wafer Lapping Plate/Japan

Wafer Lapping Plate from Japan

Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve ultra-flat surfaces on semiconductor wafers before fabrication. HTS 8473.50.9000 classification due to principal use with 8471 semiconductor processing machines. Critical for wafer planarity specifications.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Require flatness specification documentation (bow/warp measurements); surface finish certification mandatory; consider conditioning slurry import separately