Wafer Lapping Plate from Germany
Cast iron or ceramic lapping plate used in wafer grinders/lappers to achieve ultra-flat surfaces on semiconductor wafers before fabrication. HTS 8473.50.9000 classification due to principal use with 8471 semiconductor processing machines. Critical for wafer planarity specifications.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Require flatness specification documentation (bow/warp measurements); surface finish certification mandatory; consider conditioning slurry import separately