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Wafer Edge Grinder Collet from Mexico

Precision collet that grips semiconductor wafers by edge for edge grinding to remove damage layers from slicing. Classifies under HTS 8473.50.9000 as part for wafer preparation machines. Ensures chip-free edge profiles.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

Import Tips

Grip force and wafer size range specs; material compatibility (Si, GaAs); runout tolerance certification