8473.50.90.00/Wafer Edge Grinder Collet/Japan

Wafer Edge Grinder Collet from Japan

Precision collet that grips semiconductor wafers by edge for edge grinding to remove damage layers from slicing. Classifies under HTS 8473.50.9000 as part for wafer preparation machines. Ensures chip-free edge profiles.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Grip force and wafer size range specs; material compatibility (Si, GaAs); runout tolerance certification

Wafer Edge Grinder Collet from Japan — Import Duty Rate | HTS 8473.50.90.00