8473.50.90.00/Wafer Edge Grinder Collet/Japan

Wafer Edge Grinder Collet from Japan

Precision collet that grips semiconductor wafers by edge for edge grinding to remove damage layers from slicing. Classifies under HTS 8473.50.9000 as part for wafer preparation machines. Ensures chip-free edge profiles.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Grip force and wafer size range specs; material compatibility (Si, GaAs); runout tolerance certification