Wafer Edge Grinder Collet from China
Precision collet that grips semiconductor wafers by edge for edge grinding to remove damage layers from slicing. Classifies under HTS 8473.50.9000 as part for wafer preparation machines. Ensures chip-free edge profiles.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Grip force and wafer size range specs; material compatibility (Si, GaAs); runout tolerance certification