Wafer Edge Grinder Collet from Canada
Precision collet that grips semiconductor wafers by edge for edge grinding to remove damage layers from slicing. Classifies under HTS 8473.50.9000 as part for wafer preparation machines. Ensures chip-free edge profiles.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Grip force and wafer size range specs; material compatibility (Si, GaAs); runout tolerance certification