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8473.50.90.00/Semiconductor Wafer Chuck/Japan

Semiconductor Wafer Chuck from Japan

Vacuum or electrostatic chuck that securely holds silicon wafers during grinding, polishing, and inspection in semiconductor equipment. Falls under HTS 8473.50.9000 for use with 8470-8472 machines. Provides particle-free wafer handling.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Vacuum specification and ESD ratings required; surface topography certification; helium backside cooling documentation if applicable

Semiconductor Wafer Chuck from Japan — Import Duty Rate | HTS 8473.50.90.00