Semiconductor Wafer Chuck from China
Vacuum or electrostatic chuck that securely holds silicon wafers during grinding, polishing, and inspection in semiconductor equipment. Falls under HTS 8473.50.9000 for use with 8470-8472 machines. Provides particle-free wafer handling.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Vacuum specification and ESD ratings required; surface topography certification; helium backside cooling documentation if applicable