Crystal Boule Grinder Spindle Assembly from China
Rotating spindle assembly for crystal grinders that shape semiconductor boules to exact wafer diameters and grind orientation flats. Falls under HTS 8473.50.9000 as it works with semiconductor processing machines across 8470-8472 headings. Provides vibration-free precision grinding.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Include technical drawings showing semiconductor-specific tolerances; ensure spindle balance certification; check for ITAR restrictions on precision components