8473.40.86.00/Wafer Thickness Measurement Station/Japan

Wafer Thickness Measurement Station from Japan

Inline station measuring semiconductor wafer thickness uniformity using laser interferometry for process control. Classified under HTS 8473.40.86.00 when integral to wafer preparation equipment of heading 8472. Ensures wafers meet fab dimensional specifications.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document integration with upstream lapping/polishing equipment

• Specify measurement resolution (e.g

• 0.1μm) proving semiconductor application

• Distinguish process control from standalone metrology tools