Wafer Thickness Measurement Station from Japan
Inline station measuring semiconductor wafer thickness uniformity using laser interferometry for process control. Classified under HTS 8473.40.86.00 when integral to wafer preparation equipment of heading 8472. Ensures wafers meet fab dimensional specifications.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document integration with upstream lapping/polishing equipment
• Specify measurement resolution (e.g
• 0.1μm) proving semiconductor application
• Distinguish process control from standalone metrology tools