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8473.40.86.00/Wafer Polishing Pad Conditioner/Japan

Wafer Polishing Pad Conditioner from Japan

Diamond disk conditioner that dresses CMP polishing pads to maintain uniform removal rates during semiconductor wafer polishing. HTS 8473.40.86.00 classification as accessory for heading 8472 wafer processing machines. Essential for consistent planarization performance.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include pad groove pattern specifications matching commercial CMP pads

• Prove kinematic compatibility with standard polishers

• Distinguish from general surface preparation tools