8473.40.86.00/Wafer Polishing Pad Conditioner/China

Wafer Polishing Pad Conditioner from China

Diamond disk conditioner that dresses CMP polishing pads to maintain uniform removal rates during semiconductor wafer polishing. HTS 8473.40.86.00 classification as accessory for heading 8472 wafer processing machines. Essential for consistent planarization performance.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

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Import Tips

• Include pad groove pattern specifications matching commercial CMP pads

• Prove kinematic compatibility with standard polishers

• Distinguish from general surface preparation tools