8473.40.86.00/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Machine using abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness specifications. HTS 8473.40.86.00 covers this wafer preparation equipment for heading 8472 semiconductor machines. Prepares wafer surface before final polishing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document achievable flatness specs (e.g

• <1μm TTV) confirming semiconductor precision

• Include slurry handling system details in classification support

• Prevent reclassification as general surface grinding under 8460.29