Wafer Lapping Machine from Germany
Machine using abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness specifications. HTS 8473.40.86.00 covers this wafer preparation equipment for heading 8472 semiconductor machines. Prepares wafer surface before final polishing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document achievable flatness specs (e.g
• <1μm TTV) confirming semiconductor precision
• Include slurry handling system details in classification support
• Prevent reclassification as general surface grinding under 8460.29