Wafer Lapping Machine from China
Machine using abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness specifications. HTS 8473.40.86.00 covers this wafer preparation equipment for heading 8472 semiconductor machines. Prepares wafer surface before final polishing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document achievable flatness specs (e.g
• <1μm TTV) confirming semiconductor precision
• Include slurry handling system details in classification support
• Prevent reclassification as general surface grinding under 8460.29